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TC74VCXHR162652FT
TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic
TC74VCXHR162652FT
Low-Voltage 16-Bit Bus Transceiver/Register with Bushold
The TC74VCXHR162652FT is a high-performance CMOS 16-bit bus transceiver/register. Designed for use in 1.8-V, 2.5-V or 3.3-V systems, it achieves high-speed operation while maintaining the CMOS low power dissipation. This device is bus transceiver with 3-state outputs, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the internal registers. The 26- series resistor helps reducing output overshoot and undershoot without external resistor. The A, B data inputs include active bushold circuitry, Weight: 0.25 g (typ.) eliminating the need for external pull-up resistors to hold unused or floating data inputs at a valid logic level. All inputs are equipped with protection circuits against static discharge.
Features (Note)
* * * * 26- series resistors on outputs Low-voltage operation: VCC = 1.8 to 3.6 V Bushold on data inputs eliminating the need for external pull-up/pull-down resistors High-speed operation : tpd = 3.8 ns (max) (VCC = 3.0 to 3.6 V) : tpd = 4.9 ns (max) (VCC = 2.3 to 2.7 V) : tpd = 9.8 ns (max) (VCC = 1.8 V) * * 3.6-V tolerant control inputs Output current : IOH/IOL = 12 mA (min) (VCC = 3.0 V) : IOH/IOL = 8 mA (min) (VCC = 2.3 V) : IOH/IOL = 4 mA (min) (VCC = 1.8 V) * * * Latch-up performance: -300 mA ESD performance: Machine model 200 V Human body model 2000 V Package: TSSOP Note: Do not apply a signal to any bus pins when it is in the output mode. Damage may result.
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Pin Assignment (top view) IEC Logic Symbol
56 1 55 54 2 3 29 28 30 31 27 26 5 1
1OEAB 1CAB 1SAB GND 1A1 1A2 VCC 1A3 1A4
1 2 3 4 5 6 7 8 9
56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29
1OEBA
1CBA 1SBA GND 1B1 1B2 VCC 1B3 1B4 1B5 GND 1B6
1OEBA 1OEAB
EN1 (BA) EN2 (AB) C3 G4 C5 G6 EN7 (BA) EN8 (AB) C9 G10 C11 G12
> 14
1CBA 1SBA 1CAB 1SAB
2OEBA 2OEAB
2CBA 2SBA 2CAB 2SAB 1A1
3D
>1
52
1B1
41 6
6
1A5 10 GND 11 1A6 12 1A7 13 1A8 14 2A1 15 2A2 16 2A3 17 GND 18 2A4 19 2A5 20 2A6 21 VCC 22 2A7 23 2A8 24 GND 25 2SAB 26 2CAB 27 2OEAB 28
5D 1
1A2 1A3 6 8 9 10 12 13 14 15
2
51 49 48 47 45 44 43 1B2 1B3 1B4 1B5 1B6 1B7 1B8 2B1
1B7 1B8 2B1 2B2 2B3 GND 1A8 2B4 2B5 2B6 VCC 2B7 2B8 GND 2SBA 2CBA 2A4 2A5 2A6 2A7 2A8 2A2 2A3 16 17 19 20 21 23 24 2A1 1A4 1A5 1A6 1A7
> 1 10
9D
42
7
11D 1 12
10 1 >1 12
8
41 40 38 37 36 34 33 2B2 2B3 2B4 2B5 2B6 2B7 2B8
2OEBA
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Truth Table
Control Inputs OEAB Bus SAB X SBA X A Input Z X Input X* X* L X L H X* H H X* X* H X L X L H X L X* H X H Output X* X* X L L H X* L L X* X* X H X L L H Qn L X* X H H Output H L X* X* H H B Input Z X Output L H L H Qn L H Input L H L H X L H Output The data in the A storage flop-flops are displayed on the B Bus, and the data in the B storage flop-flops are displayed on the A. The data on the B Bus are displayed on the A Bus, and are stored into the B storage flip-flops on the rising edge of CBA. The data in the B storage flip-flops are displayed on the A Bus. The data on the B Bus are stored into the B storage flip-flops on the rising edge of CBA, and the stored data propagate directly onto the A Bus. The data on the B Bus are displayed on the A bus. The data on the A bus are displayed on the B Bus, and are stored into the A storage flip-flops on the rising edge of CAB. The data in the A storage flop-flops are displayed on the B Bus. The data on the A Bus are stored into the A storage flip-flops on the rising edge of CAB, and the stored data propagate directly onto the B Bus. The data on the A bus are displayed on the B bus.
OEBA
CAB X*
CBA X*
Function The output functions of A and B Busses are disabled. Both A and B Busses are used as inputs to the internal flip-flops. Data on the Bus will be stored on the rising edge of the Clock.
L
H X X
Qn
Qn
X: Don't care Z: High impedance Qn: The data stored into the internal flip-flops by most recent low to high transition of the clock inputs. *: The clocks are not internally gated with either OEAB or OEBA . Therefore, data on the A and/or B busses may be clocked into the storage flip-flops at any time.
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System Diagram
1
1OEAB
1OEBA
56
A
1A1
5
D CK
Q
A
B
B
Q
D CK
52
1B1
1A8 1CAB 1SAB
14 2 3
A
Same as above block
43 55
B
1B8 1CBA 1SBA
54
A
B
2OEAB
28
2OEBA
29
A
2A1
15
D CK
Q
A
B B Q D CK 42 2B1
2A8 2CAB 2SAB
24 27 26 A
Same as above block
33 30 B 31
2B8 2CBA 2SBA
A
B
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Timing Chart
OEAB OEBA SAB
SBA
CAB
CBA
A
B A: Input B: Output A: Output B: Input
: Don't care
Absolute Maximum Ratings (Note 1)
Characteristics Power supply voltage DC input voltage DC output voltage Input diode current Output diode current Output current Power dissipation DC VCC/ground current per supply pin Storage temperature (OEAB, OEBA , SAB, SBA, CAB, CBA) (An, Bn) Symbol VCC Rating -0.5 to 4.6 -0.5 to 4.6 VIN -0.5 to VCC + 0.5 (Note 2) VOUT IIK IOK IOUT PD ICC/IGND Tstg -0.5 to VCC + 0.5 (Note 3) -50 50 50 400 100 -65 to 150 (Note 4) V mA mA mA mW mA C V Unit V
(An, Bn)
Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 2: OFF state Note 3: High or low state. IOUT absolute maximum rating must be observed. Note 4: VOUT < GND, VOUT > VCC
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Operating Ranges (Note 1) (Note 2)
Characteristics Power supply voltage (OEAB, OEBA , SAB, SBA, CAB, CBA) (An, Bn) (An, Bn) VOUT Symbol VCC Rating 1.8 to 3.6 1.2 to 3.6 (Note 3) -0.3 to 3.6 0 to VCC (Note 4) 0 to VCC (Note 5) 12 Output current IOH/IOL 8 4 Operating temperature Input rise and fall time Topr dt/dv -40 to 85 0 to 10 (Note 9) (Note 6) (Note 7) (Note 8) C ns/V mA V Unit V
Input voltage Output voltage
VIN
V
Note 1: The operating ranges must be maintained to ensure the normal operation of the device. Unused inputs must be tied to either VCC or GND. Note 2: Floating or unused control inputs must be held high or low. Note 3: Data retention only Note 4: OFF state Note 5: High or low state Note 6: VCC = 3.0 to 3.6 V Note 7: VCC = 2.3 to 2.7 V Note 8: VCC = 1.8 V Note 9: VIN = 0.8 to 2.0 V, VCC = 3.0 V
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Electrical Characteristics
< DC Characteristics (Ta = -40 to 85C, 2.7 V < VCC = 3.6 V)
Characteristics H-level L-level Symbol VIH VIL Test Condition IOH = -100 A H-level VOH VIN = VIH or VIL IOH = -6 mA IOH = -8 mA Output voltage IOH = -12 mA IOL = 100 A L-level VOL VIN = VIH or VIL IOL = 6 mA IOL = 8 mA IOL = 12 mA Input leakage current (OEAB, OEBA , SAB, SBA, CAB, CBA) Bushold input minimum drive hold current Bushold input over-drive current to change state 3-state output OFF state current Quiescent supply current Increase in ICC per input IIN VIN = 0 to 3.6 V VIN = 0.8 V VIN = 2.0 V (Note 1) (Note 2) VIN = VIH or VIL VOUT = VCC or GND VIN = VCC or GND VIH = VCC - 0.6 V 2.7 to 3.6 3.0 3.0 3.6 3.6 2.7 to 3.6 2.7 to 3.6 2.7 to 3.6 75 -75 5.0 450 -450 10.0 20.0 750 A VCC (V) 2.7 to 3.6 2.7 to 3.6 2.7 to 3.6 2.7 3.0 3.0 2.7 to 3.6 2.7 3.0 3.0 Min 2.0 VCC - 0.2 2.2 2.4 2.2 Max 0.8 0.2 0.4 0.5 0.8 V Unit
Input voltage
V
II (HOLD)
A
II (OD)
A
IOZ ICC ICC
A A A
Note 1: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 2: An external driver must sink at least the specified current to switch from HIGH-to-LOW.
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< < DC Characteristics (Ta = -40 to 85C, 2.3 V = VCC = 2.7 V)
Characteristics H-level L-level Symbol VIH VIL Test Condition IOH = -100 A H-level Output voltage VOH VIN = VIH or VIL IOH = -4 mA IOH = -6 mA IOH = -8 mA IOL = 100 A L-level VOL VIN = VIH or VIL IOL = 6 mA IOL = 8 mA Input leakage current (OEAB, OEBA , SAB, SBA, CAB, CBA) Bushold input minimum drive hold current Bushold input over-drive current to change state 3-state output OFF state current Quiescent supply current IIN VIN = 0 to 3.6 V VIN = 0.7 V VIN = 1.6 V (Note 1) (Note 2) VIN = VIH or VIL VOUT = VCC or GND VIN = VCC or GND 2.3 to 2.7 2.3 2.3 2.7 2.7 2.3 to 2.7 2.3 to 2.7 45 -45 5.0 300 -300 10.0 20.0 A VCC (V) 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 2.3 2.3 2.3 2.3 to 2.7 2.3 2.3 Min 1.6 VCC - 0.2 2.0 1.8 1.7 Max 0.7 0.2 0.4 0.6 V Unit
Input voltage
V
II (HOLD)
A
II (OD)
A
IOZ ICC
A A
Note 1: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 2: An external driver must sink at least the specified current to switch from HIGH-to-LOW.
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< DC Characteristics (Ta = -40 to 85C, 1.8 V = VCC < 2.3 V)
Characteristics Symbol Test Condition IOH = -100 A IOH = -4 mA L-level Input leakage current (OEAB, OEBA , SAB, SBA, CAB, CBA) Bushold input minimum drive hold current Bushold input over-drive current to change state 3-state output OFF state current Quiescent supply current IIN VIN = 0 to 3.6 V VIN = 0.36 V VIN = 1.26 V (Note 1) (Note 2) VIN = VIH or VIL VOUT = VCC or GND VIN = VCC or GND 1.8 1.8 1.8 1.8 1.8 1.8 1.8 25 -25 5.0 200 -200 10.0 20.0 A VOL VIN = VIH or VIL IOL = 100 A IOL = 4 mA VCC (V) 1.8 to 2.3 1.8 to 2.3 1.8 1.8 1.8 1.8 Min 0.7 x VCC VCC - 0.2 1.4 Max 0.2 x VCC 0.2 0.3 V V Unit
H-level Input voltage L-level
VIH VIL
H-level Output voltage
VOH
VIN = VIH or VIL
II (HOLD)
A
II (OD)
A
IOZ ICC
A A
Note 1: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 2: An external driver must sink at least the specified current to switch from HIGH-to-LOW.
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AC Characteristics (Ta = -40 to 85C, input: tr = tf = 2.0 ns, CL = 30 pF, RL = 500 ) (Note 1)
Characteristics Symbol Test Condition VCC (V) 1.8 Maximum clock frequency fmax Figure 1, Figure 3 2.5 0.2 3.3 0.3 Propagation delay time (An, Bn-Bn, An) tpLH tpHL 1.8 Figure 1, Figure 2 2.5 0.2 3.3 0.3 1.8 Figure 1, Figure 3 2.5 0.2 3.3 0.3 1.8 Figure 1, Figure 2 2.5 0.2 3.3 0.3 1.8 Figure 1, Figure 4, Figure 5 2.5 0.2 3.3 0.3 1.8 Figure 1, Figure 4, Figure 5 2.5 0.2 3.3 0.3 1.8 Figure 1, Figure 3 2.5 0.2 3.3 0.3 1.8 Minimum setup time ts Figure 1, Figure 3 2.5 0.2 3.3 0.3 1.8 Minimum hold time th Figure 1, Figure 3 2.5 0.2 3.3 0.3 tosLH tosHL 1.8 (Note 2) 2.5 0.2 3.3 0.3 Min 100 200 250 1.5 0.8 0.6 1.5 0.8 0.6 1.5 0.8 0.6 1.5 0.8 0.6 1.5 0.8 0.6 4.0 1.5 1.5 2.5 1.5 1.5 1.0 1.0 1.0 Max 9.8 4.9 3.8 9.8 5.8 4.1 9.8 5.8 4.4 9.8 5.9 4.3 9.4 5.2 4.5
Unit
MHz
ns
Propagation delay time (CAB, CBA-Bn, An)
tpLH tpHL
ns
Propagation delay time (SAB, SBA-Bn, An)
tpLH tpHL
ns
Output enable time (OEAB, OEBA -An, Bn)
tpZL tpZH
ns
Output disable time (OEAB, OEBA -An, Bn)
tpLZ tpHZ
ns
Minimum pulse width
tw (H) tw (L)
0.5 0.5 0.5
ns
ns
ns
Output to output skew
ns
Note 1: For CL = 50 pF, add approximately 300 ps to the AC maximum specification. Note 2: Parameter guaranteed by design. (tosLH = |tpLHm - tpLHn|, tosHL = |tpHLm - tpHLn|)
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Dynamic Switching Characteristics
(Ta = 25C, input: tr = tf = 2.0 ns, CL = 30 pF, RL = 500 )
Characteristics Symbol Test Condition VIH = 1.8 V, VIL = 0 V Quiet output maximum dynamic VOL VOLP VIH = 2.5 V, VIL = 0 V VIH = 3.3 V, VIL = 0 V VIH = 1.8 V, VIL = 0 V Quiet output minimum dynamic VOL VOLV VIH = 2.5 V, VIL = 0 V VIH = 3.3 V, VIL = 0 V VIH = 1.8 V, VIL = 0 V Quiet output minimum dynamic VOH VOHV VIH = 2.5 V, VIL = 0 V VIH = 3.3 V, VIL = 0 V (Note) (Note) (Note) (Note) (Note) (Note) (Note) (Note) (Note) VCC (V) 1.8 2.5 3.3 1.8 2.5 3.3 1.8 2.5 3.3 Typ. 0.15 0.25 0.35 -0.15 -0.25 -0.35 1.55 2.05 2.65 V V V Unit
Note:
Parameter guaranteed by design.
Capacitive Characteristics (Ta = 25C)
Characteristics Input capacitance Bus I/O capacitance Power dissipation capacitance Symbol CIN CI/O CPD Test Condition (OEAB, OEBA , CAB, CBA, SAB, SBA) An, Bn fIN = 10 MHz (Note) VCC (V) 1.8, 2.5, 3.3 1.8, 2.5, 3.3 1.8, 2.5, 3.3 Typ. 6 7 20 Unit pF pF pF
Note:
CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC (opr) = CPDVCCfIN + ICC/16 (per bit)
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AC Test Circuit
6.0 V or VCC x 2 Open GND Measure
CL RL
Switch
RL
Parameter tpLH, tpHL tpLZ, tpZL tpHZ, tpZH 6.0 V VCC x 2
Switch Open @VCC = 3.3 0.3 V @VCC = 2.5 0.2 V @VCC = 1.8 V GND
Output
CL = 30 pF RL = 500
Figure 1 AC Waveform
tr 2.0 ns Input (An, Bn, SAB, SBA) tf 2.0 ns 90% VM VIH 10% GND VOH VM tpLH tpHL VOL
Output (Bn, An)
Figure 2 tpLH, tpHL
tr 2.0 ns Input (CAB, CBA)
tf 2.0 ns VIH GND tw (H) tw (L) VIH VM ts (H) th (H) ts (L) th (L) GND VOH VM VOL
10%
90% VM
Input (An, Bn)
Output (Bn, An) tpHL
tpLH
Figure 3 tpLH, tpHL, tw, ts, th
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tr 2.0 ns Output Enable Control ( OEBA ) tpLZ Output (An) Low to Off to Low tpHZ Output (An) High to Off to High Outputs enabled tf 2.0 ns 90% VM VIH 10% tpZL 3.0 V or VCC VM VX tpZH VOL VOH VM GND Outputs disabled Outputs enabled GND
VY
Figure 4 tpLZ, tpHZ, tpZL, tpZH
tf 2.0 ns Output Enable Control (OEAB)
tr 2.0 ns 90% VM VIH GND 3.0 V or VCC VM VX tpZL VOL VOH VM tpZH GND
10%
Output (Bn) Low to Off to Low
tpLZ
Output (Bn) High to Off to High tpHZ
VY
Figure 5 tpLZ, tpHZ, tpZL, tpZH
VCC 3.3 0.3 V 2.7 V 1.5 V VOL + 0.3 V VOH - 0.3 V 2.5 0.2 V VCC VCC/2 VOL + 0.15 V VOH - 0.15 V 1.8 V VCC VCC/2 VOL + 0.15 V VOH - 0.15 V
Symbol VIH VM VX VY
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Package Dimensions
Weight: 0.25 g (typ.)
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RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN GENERAL
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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